SinkPad MCPCB
SinkPad metal-core PCB
SinkPad and thermoelectric metal-core construction for higher heat flux than a standard dielectric pad. Copper metal conductivity is published up to about 398 W/m·K.
Published specification
| Parameter | Published value |
|---|---|
| Construction | Thermoelectric / SinkPad |
| Core metal | Aluminum or copper |
| Copper conductivity | Up to about 398 W/m·K for the metal |
| Dielectric thermal conductivity | About 0.8–3.0 W/m·K, stack-up dependent |
| Dimensional stability | About 2.5–3.0% size change from 30 °C to 140–150 °C, typical |
| Primary benefit | Heat removal from LEDs and power devices through the metal base |
Where this applies
LED and power devices that need a thermoelectric or SinkPad path into the metal base.
The hub lists SinkPad as a thermoelectric construction, separate from single-layer, double-sided, and multilayer boards. The figure of about 398 W/m·K is the copper metal, not the dielectric. Dielectric conductivity stays in the stack-up range of about 0.8–3.0 W/m·K.
Questions
What is the published SinkPad description?
Thermoelectric / SinkPad constructions on the metal-core hub.
Does 398 W/m·K apply to the dielectric?
No. That figure is the copper metal. The dielectric is about 0.8–3.0 W/m·K and depends on the stack-up.
Enquiry
Ask for this specification.
Send the operating point, mounting, and any drawing. We typically reply within 24–48 hours with what this construction can and cannot cover.