PCB Fabrication
Choose the substrate. Skip the boilerplate.
FR4, metal-core, ceramic and special constructions — each page covers capabilities and process only.
01 Substrates
Four fabrication lanes
Open the family that matches your stack-up. Assembly stays on its own page.
Standard
FR4 PCB
Multi-layer, HDI, heavy copper, high-Tg and RF on FR4 laminates.
Open FR4 →
Thermal
Metal-core PCB
Aluminum and copper IMS boards for LED and power dissipation.
Open metal-core →
Harsh duty
Ceramic PCB
Alumina and ceramic process families for high temp and reliability.
Open ceramic →
Advanced
Special PCB
Impedance-controlled, bus-bar and other non-standard constructions.
Open special →CTA Get a quote
Send Gerbers or a brief. We will reply with a clear path.
Share layer count, material family, quantity and attach Gerbers or drawings.