Single layer
One trace layer on metal core.
Metal-core PCB
MCPCB / IMS for heat that has somewhere to go.
Aluminum and copper core boards — single layer, COB, double-sided, multilayer and SinkPad constructions for LED and power thermal paths.
01 Constructions
Metal-core board types
COB MCPCB
Chip-on-board metal-core layouts.
Double sided
Traces on both sides of the core stack.
Multilayer
Multi trace-layer metal-core builds.
SinkPad
Thermoelectric / SinkPad constructions.
Thermoelectric copper
Separation copper for high heat flux.
02 Capabilities
MCPCB / IMS envelope
| Parameter | Typical range |
|---|---|
| Core metal | Aluminum or copper |
| Constructions | Single layer, COB, double layer / double sided, multilayer, SinkPad |
| Dielectric thermal conductivity | ~0.8 – 3.0 W/m·K (stack-up dependent) |
| Aluminum thermal conductivity | ~237 W/m·K (metal) |
| Copper MCPCB thermal conductivity | Up to ~398 W/m·K (metal) |
| Dimensional stability | ~2.5 – 3.0% size change from 30 °C to 140–150 °C (typical) |
| Primary benefit | Heat removal from LEDs / power devices via metal base |
| Applications | LED lighting, industrial power, automotive, converters, audio power, OA drivers, heat sinks |
Numeric fab grids for MCPCB vary by core and dielectric — send thermal brief and Gerbers for a confirmed envelope.
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Send Gerbers or a brief. We will reply with a clear path.
Include core metal, construction and thermal notes — attach Gerbers or drawings.