Thick film
Single–double sided, up to 4L.
Ceramic PCB
Ceramic boards for environments FR4 cannot hold.
Alumina, AlN, ZTA and Si3N4 substrates with DPC, DBC, AMB, thick film, LTCC and HTCC process families.
01 Process families
Ceramic constructions
Process family is selected by thermal, RF and mechanical need.
Thin film
Fine features on ceramic substrates.
DPC
Direct plated copper, single–double sided.
DBC / DCB
Direct bonded copper for power thermal paths.
AMB
Active metal brazed ceramic boards.
LTCC
Low-temp co-fired; general to 6L, special to 14L.
HTCC
High-temp co-fired multilayer ceramic.
Ceramic package
Package and carrier constructions.
02 Capabilities
Ability in process technology
Migrated manufacturing envelope — confirm final limits against your drawings.
| Item | General parameter | Special process |
|---|---|---|
| Al2O3 | High insulation, chemical and high-temp resistance | Glass, quartz, sapphire, 99% / 92% Al2O3 (black) |
| AlN | Excellent thermal conductivity, low CTE, high-temp | Glass, quartz, sapphire, 99% / 92% Al2O3 (black) |
| ZTA | Insulation performance and high-temp stability | Glass, quartz, sapphire, 99% / 92% Al2O3 (black) |
| Si3N4 | High strength, hardness, thermal conductivity, low dielectric loss | Glass, quartz, sapphire, 99% / 92% Al2O3 (black) |
| Conductor (LTCC/HTCC) | Tungsten, Au, Au&Pd, Au&Pb, Ag, Ag&Pd, Ag&Pb | Glass, quartz, sapphire, 99% / 92% Al2O3 (black) |
| DPC | Single – double sided | — |
| DBC | Single – double sided | — |
| AMB | Single – double sided | — |
| Thick film | Single – double sided, 4L | — |
| LTCC | Single – double sided, 4L, 6L | 6L – 14L |
| HTCC | Single – double sided, 4L, 6L | — |
| Inner layer | — | — |
| Outer layer | 1 oz – 3 oz (DPC) | 3 oz – 12 oz (DBC / AMB) |
| Max. dimension | 130 × 180 mm | Larger on evaluation |
| Min. dimension | 2 × 2 mm | Shipped in panel |
| Substrate thickness | Al2O3/AlN: 0.38 / 0.635 / 1.0 mm; Si3N4: 0.25 / 0.32 mm | > 1.5 mm |
| OSP | 0.2 – 0.5 µm | — |
| ENIG | Au 1–3 µ"; Ni 120–320 µ" | — |
| Immersion silver | 6 – 12 µ" | — |
| Immersion tin | ≥ 1 µm | — |
| ENEPIG | Au 2 µ", Pd 1 µ", Ni 100 µ" | — |
| Hard gold | Au 5–30 µ"; Ni 120–200 µ" | — |
| Min. PTH | 0.05 mm | — |
| Min. NPTH | 0.05 mm | — |
| Max. aspect ratio (PTH) | 5:1 | — |
| NPTH tolerance | ±0.05 mm | — |
| PTH tolerance | ±0.05 mm | — |
| Dielectric / mask | Glass glaze, medium, solder mask ink | — |
| Solder mask color | White, black, green | Mixed color |
| Silkscreen color | White, black | Mixed color |
| Silkscreen size | Line width ≥ 0.13 mm; height ≥ 0.8 mm | — |
| Solder mask thickness | ≥ 20 µm | — |
| Solder mask bridge | ≥ 0.15 mm | 0.1 mm |
| Outline tolerance | ±0.05 mm | ±0.1 mm |
| Min. tolerance (PTH) | ±0.05 mm | ±0.1 mm |
| Min. tolerance (NPTH) | ±0.05 mm | ±0.1 mm |
| Min. circuit to board edge | 0.2 mm | 0.15 mm |
| Finished thickness | 0.2 – 2.0 mm | ≥ 2.0 mm |
| Min. finished board thickness tol. | <1.0 mm: ±0.1 mm; >1.0 mm: ±10% | — |
Values describe a typical manufacturing envelope. Final capability is confirmed against your Gerbers and stack-up.
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