Thermoelectric copper MCPCB
Thermoelectric separation copper PCB
Separation-copper MCPCB for high heat flux. Copper metal conductivity is published up to about 398 W/m·K, with a stack-up-dependent dielectric of about 0.8–3.0 W/m·K.
Published specification
| Parameter | Published value |
|---|---|
| Construction | Thermoelectric separation copper |
| Published role | Separation copper for high heat flux |
| Copper conductivity | Up to about 398 W/m·K for the metal |
| Aluminum alternative | About 237 W/m·K for the aluminum metal on other builds |
| Dielectric thermal conductivity | About 0.8–3.0 W/m·K, stack-up dependent |
| Dimensional stability | About 2.5–3.0% size change from 30 °C to 140–150 °C, typical |
Where this applies
High heat-flux power and LED paths that use a separation-copper construction rather than an aluminum base.
The hub publishes this build as separation copper for high heat flux. Aluminum at about 237 W/m·K is the other core metal. This page is the copper separation build. Numeric fab limits are confirmed from Gerbers.
Questions
How is this different from a standard aluminum MCPCB?
This construction is separation copper for high heat flux. Aluminum conductivity is published separately at about 237 W/m·K for the metal.
What has to be confirmed before fabrication?
The hub says numeric fab grids vary by core and dielectric, and are confirmed from the thermal brief and Gerbers.
Enquiry
Ask for this specification.
Send the operating point, mounting, and any drawing. We typically reply within 24–48 hours with what this construction can and cannot cover.