Busbar PCB
High-current distribution structures.
Special PCB
Impedance, bus-bar, HDI and non-standard builds.
Controlled impedance, bus-bar, IC substrate, extra-thin, heavy copper, high-Tg and high-speed constructions outside routine FR4 quoting.
01 Constructions
Special board families
IC substrate
Package / substrate class boards.
HDI
Micro vias under 0.25 mm (10 mil).
Extra-thin
≤ 0.6 mm; down to 0.15 – 0.30 mm class.
Heavy copper
Including ~10 oz class builds.
High-Tg
Elevated Tg laminates for thermal duty.
High-speed
High-frequency / high-speed layouts.
Impedance control
Stack-up held to target impedance.
02 Capabilities
Special construction notes
| Item | Capabilities |
|---|---|
| Scope | High frequency, heavy copper (incl. ~10 oz), buried/blind vias, bus-bar, IC substrate, extra-thin, HDI, high-Tg, high-speed, impedance control |
| Extra-thin thickness | Standard boards often 1.0–2.0 mm; extra-thin ≤ 0.6 mm; 0.1–0.4 mm called out for SIM/sensor-class; manufactured examples 0.15 / 0.20 / 0.25 / 0.30 mm |
| Extra-thin copper | ½ oz – 3 oz |
| Extra-thin materials | Flexible / FR4 / BT / other specialized laminates |
| HDI micro vias | Under 0.25 mm (10 mil); smaller pads; higher pad density |
| Impedance | Controlled to drawing; confirm tolerance with stack-up |
| Quote inputs | Gerbers/ODB++, stack-up, impedance targets, copper/current goals, quantity, assembly flag |
Special builds are reviewed case by case — send drawings early so we route the right process family.
CTA Get a quote
Send Gerbers or a brief. We will reply with a clear path.
Include impedance or copper goals — attach Gerbers, STL, STEP or ZIP.