Populated assemblies
Fine-pitch and mixed packages.
PCB Assembly
SMT and THT builds — stencil to ship.
Turnkey or consigned PCBA with stencil print, placement, reflow or wave, inspection and functional checks as agreed.
01 Process
Quality-focused assembly flow
Three clear stages — no marketing filler.
-
STEP 01
Prepare
Gerber/BOM review, stencil, kitting and line setup for the revision you approve.
-
STEP 02
Assemble
SMT placement and reflow; THT and wave where required; mixed technology supported.
-
STEP 03
Inspect & test
AOI / visual inspection and agreed electrical or functional checks before ship.
02 Line reality
What the build looks like
Dense SMT
High component count boards.
Power stages
Larger packages and connectors.
Placement
Controlled SMT placement process.
03 Capacities
Assembly envelope
| Item | Capability |
|---|---|
| Assembly type | SMT, THT, mixed assembly |
| Bare board size | 0.2 × 0.2" – 20 × 20" / 22 × 47.5" |
| Minimum SMD | 01005 |
| Minimum BGA pitch | 0.25 mm |
| Maximum component size | 50 × 150 mm |
| Component package | Reels, cut tape, tube, tray, loose parts |
| Sourcing | Turnkey, partial, or consigned BOM |
| Typical lead time | 1 – 5 days (programme-dependent) |
| Volume | Prototype through low–mid production |
CTA Get a quote
Send Gerbers or a brief. We will reply with a clear path.
Include layer count, quantity, stack-up notes, and assembly needs if known.