COB MCPCB
Chip-on-board metal-core PCB
COB metal-core layout for LED modules on an aluminum or copper base. Heat leaves through the metal, with dielectric conductivity about 0.8–3.0 W/m·K.
Published specification
| Parameter | Published value |
|---|---|
| Construction | COB metal-core layout |
| Core metal | Aluminum or copper |
| Dielectric thermal conductivity | About 0.8–3.0 W/m·K, stack-up dependent |
| Aluminum conductivity | About 237 W/m·K for the metal |
| Copper conductivity | Up to about 398 W/m·K for the metal |
| Primary benefit | Heat removal from LEDs through the metal base |
Where this applies
Chip-on-board LED layouts that place the die on a metal-core board.
The hub publishes COB as chip-on-board metal-core layouts. This page does not state a die-attach process, a bin, or a lumen rating. Conductivity numbers are the shared MCPCB envelope.
Questions
What does COB mean on this page?
Chip-on-board metal-core layouts, as listed on the metal-core hub.
Which core metals are published?
Aluminum or copper.
Enquiry
Ask for this specification.
Send the operating point, mounting, and any drawing. We typically reply within 24–48 hours with what this construction can and cannot cover.