High-Precision
PCB Fabrication
From 2-layer rapid prototypes to complex 16-layer RF systems. We offer Zero Tooling Costs and industrial-grade quality control for Indian engineering teams.
Fabrication Capabilities
Single & Double Sided
Cost-effective solutions for consumer electronics and industrial power systems.
- FR4 / CEM-1 Material
- 1.6mm Standard Thickness
- HASL / Lead-Free Finish
Multi-Layer Stackup
High-density interconnects for complex embedded systems and processors.
- Up to 16 Layers
- Blind & Buried Vias
- Controlled Impedance
RF & High Frequency
Specialized substrates for seamless wireless and high-speed data transmission.
- Rogers / Teflon Substrate
- Low Signal Loss
- Gold Finger Finish
Understanding
PCB Stackup & Layers
Our manufacturing process ensures perfect alignment between signal, power, and ground planes. We support specialized via technologies to maximize routing density in compact designs.
Multi-Layer
Precise lamination of core & prepreg.
Fine Pitch
Support for BGA & small SMD parts.
Standard 4-Layer High-Speed Stackup
Ready for Zero-Tooling Fabrication?
Upload your Gerber files or talk to our engineers for a design-for-manufacturing (DFM) audit today.